Automatic ultrasonic cleaning machine manufacturers are also popular in the semiconductor industry!

全球半导体产业已步入成熟期。未来10年半导体产业年均增长率放缓。手机和消费类电子产品将是推动未来半导体产业增长的主动力。未来半导体产业将是独立半导体产业的天下。未来半导体产业的整合、兼并将越演越烈。未来半导体产业技术会越来越受到关注。例如：半导体产业的基础是硅材料工业，因为硅片表面的污染物会严重影响器件的性能、可靠性、和成品率。随着微电子技术的飞速发展以及人们对原料要求的提高，污染物对器件的影响也愈加突出，清洗技术在半导体行业越来越重要。

The global semiconductor industry has entered a mature period. In the next 10 years, the average annual growth rate of semiconductor industry will slow down. Mobile phones and consumer electronics will be the driving force to promote the growth of the semiconductor industry in the future. The future semiconductor industry will be the world of independent semiconductor industry. In the future, the integration and merger of semiconductor industry will become more and more intense. In the future, more and more attention will be paid to the technology of semiconductor industry. For example, the foundation of semiconductor industry is silicon material industry, because the pollutants on the surface of silicon wafer will seriously affect the performance, reliability and yield of devices. With the rapid development of microelectronics technology and the improvement of people's requirements for raw materials, the impact of pollutants on devices is becoming more and more prominent. Cleaning technology is becoming more and more important in the semiconductor industry.
           

以前传统的浸洗、刷洗、压力冲洗、振动清洗和蒸气清洗，这些清洗方法都很容易破坏半导体表面，而且半导体制程中重复次数多的工序，清洗效果的好坏较大程度的影响芯片制程及积体电路特性等质量问题。在所有的清洗方式中全自动超声波清洗机对半导体的清洗效率高、效果好的一种，之所以超声波清洗能够达到如此的效果是与它独特的工作原理和清洗方法密切相关的。

In the past, traditional cleaning methods such as immersion, brushing, pressure cleaning, vibration cleaning and steam cleaning are easy to damage the semiconductor surface. Moreover, the repeated processes in the semiconductor process have a great impact on the quality of the chip process and integrated circuit characteristics. Among all the cleaning methods, the automatic ultrasonic cleaning machine has high efficiency and good effect on semiconductor cleaning. The reason why the ultrasonic cleaning can achieve such an effect is closely related to its unique working principle and cleaning method.

我们知道，半导体外形比较复杂，孔内小，利用全自动超声波清洗机的效率高和高清洁度，得益于其声波在介质中传播时产生的穿透性和空化冲击疚，所以很容易将带有复杂外形，内腔和细空清洗干净，在超声波作用下只需两三分钟即可完成，其速度比传统方法可提高几倍，甚几十倍，清洁度也能达到高标准，提高了对半导体的生产效率，更突出显示了用其他处理方法难以达到或不可取代的结果。

As we all know, the semiconductor has a complex shape and a small hole. The high efficiency and high cleanliness of the fully automatic ultrasonic cleaning machine are due to the penetrability and cavitation impact of the sound wave propagating in the medium. Therefore, it is easy to clean the cavity and fine air with complex shape. It only takes two or three minutes under the action of ultrasonic, Its speed can be several times or even dozens of times higher than that of traditional methods, and its cleanliness can also reach high standards, which improves the production efficiency of semiconductors, and highlights the results that can not be achieved or replaced by other treatment methods.