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超声波清洗机的超声波振板频率如何选择
来源:http://www.sinokohl.com/ 时间: 2024-06-13 浏览次数: 0
超声空化阀值和超声波的频率有密切关系,频率越高,空化阀越高。超声波清洗机换句话说,超声波发震板频率低,空化越容易产生,而且在低频情况下液体受到压缩和稀疏作用有更长的时间间隔,使气泡在解体前能生长到较大的尺寸,增高空化强度,有利于清洗作用。
The cavitation threshold of ultrasound is closely related to the frequency of ultrasound, and the higher the frequency, the higher the cavitation valve. In other words, ultrasonic cleaning machines are more prone to cavitation when the frequency of the ultrasonic vibration plate is low. In addition, under low-frequency conditions, the liquid is compressed and sparsely compressed for a longer time interval, allowing bubbles to grow to a larger size before disintegration, increasing cavitation intensity and facilitating cleaning.
所以低频超声波发震板超声清洗适用于大部件外表或者污物和清洗件外表结合度高的场所。但易腐蚀清洗件表面,不适宜清洗外表光洁度高的部件,而且空化噪音大。40KHZ左右的频率,相同声强下,发生的空化泡数量比频率为20KHZ时多,穿透力较强,宜清洗外表形状复杂或有盲孔的工件,空化噪音较小,但空化强度较低,适合清洗污物与被清洗件外表结合力较弱的场所。
So low-frequency ultrasonic vibration plate ultrasonic cleaning is suitable for places with high adhesion between the surface of large components or dirt and the surface of cleaning parts. But the surface of easily corroded cleaning parts is not suitable for cleaning components with high surface smoothness, and there is also high cavitation noise. At a frequency of around 40KHZ and the same sound intensity, there are more cavitation bubbles than at a frequency of 20KHZ, which has strong penetration power. It is recommended to clean workpieces with complex external shapes or blind holes. The cavitation noise is small, but the cavitation intensity is low, making it suitable for cleaning places where the adhesion between dirt and the surface of the cleaned part is weak.
高频超声清洗适用于计算机,微电子元件的精细清洗;兆赫超声清洗适用于集成电路芯片、硅片及波薄膜的清洗,能去除微米、亚微米级的污物而对清洗件没有任何损伤。因此从清洗效果及经济性考虑,频率一般选择在20—130KHZ范围,当然正确选择超声波发震板频率至关重要,而具体合适的工作频率的选取需要做一定的实验取得。
High frequency ultrasonic cleaning is suitable for fine cleaning of computers and microelectronic components; Megahertz ultrasonic cleaning is suitable for cleaning integrated circuit chips, silicon wafers, and wave thin films, and can remove micrometer and submicron scale dirt without any damage to the cleaned parts. Therefore, considering the cleaning effect and economy, the frequency is generally selected in the range of 20-130KHZ. Of course, the correct selection of the ultrasonic vibration plate frequency is crucial, and the specific and appropriate selection of working frequency needs to be obtained through certain experiments.
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